Manufacturer news
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Posted: November 30, 2023Categories: Manufacturer newsRead more
With the PC market bottoming out, Qualcomm Incorporated announced the new Snapdragon X Elite SoC, targeting the AI PC market. The all-new Snapdragon X Elite is manufactured using TSMC's 4-nanometer process node and is equipped with a powerful 12-core Oryon CPU. Between the Oryon CPU, Adreno GPU, and Hexagon NPU, the Snapdragon X Elite can deliver up to 75 TOPS of AI computing performance.
With the PC market bottoming out, Qualcomm Incorporated announced the new Snapdragon X Elite SoC, targeting the AI PC market. The all-new Snapdragon X Elite is manufactured using TSMC's 4-nanometer process node and is equipped with a powerful 12-core Oryon CPU. Between the Oryon CPU, Adreno GPU, and Hexagon NPU, the Snapdragon X Elite can deliver up to 75 TOPS of AI computing performance.
At the Third China Lingang International Semiconductor Conference, Gang Sun, global vice president of Qualcomm Incorporated, mentioned that Qualcomm Incorporated announced the latest version at the Snapdragon 2023 Summit in Hawaii at the end of October Snapdragon X Elite computing platform (5G+AI fusion innovation helps build an intelligent and connected world of everything). It is an ARM-based processor designed for personal computers that delivers powerful performance and better energy efficiency along with cutting-edge end-to-end generative AI capabilities. At the same time, Qualcomm Incorporated introduced the Snapdragon8 third-generation mobile chip.
Qualcomm Incorporated wants to extend the success of its ARM SoC smartphones to the PC platform
Qualcomm Incorporated Snapdragon X Elite SoC is based on the new ARM CPU core "Oryon" developed after its acquisition of Nuvia, and is built on TSMC's 4nm process node. The CPU uses ARM's 8.7 instruction set and features 12 high-performance "Oryon" cores at 3.8GHz. There is also a dual-core boost feature that delivers peak clock speeds of up to 4.3GHz. Qualcomm Incorporated says the Snapdragon X Elite's CPU performance is twicePosted: November 24, 2023Categories: Manufacturer newsRead moreThe release of Tianguet 8300 is a comprehensive decentralization of new mobile phone technology
After the release of Tianguet 9300, the usual Tianguet 8300 also came. This Tianguet 8300 compared with 8200 upgrade efforts should be said to be quite large, reflected in the positioning of the chip architecture comprehensive upgrade, to achieve all kinds of new standards.
Not long after the release of the Tianguet 9300, Mediatek immediately released the positioning of the sub-flagship Tianguet 8300 in Beijing. Readers who understand the Mediatek Tianguet AP SoC should know that the Tianguet 9000 and 8000 series are usually updated in parallel or front-to-back to target mobile phone products with different positioning. The release of the 8300 is exactly one year apart from the 8200.
Especially after the success of the original 9000 series flagship platform, the existence of the 8000 series is very important. And the reputation of the Tianguet 8000 series has been very good, especially in the excellent chip energy efficiency performance, before we said that this is the dessert-grade chip in the mobile phone AP SoC chip.
This year's Tianguet 8300 should be said to be on the basis of performance improvement, continue to get more new features originally belonging to the 9000 series, let's take a closer look
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